Copper Pipe Water Cooling Plates from qocsuing's blog

Copper Pipe Water Cooling Plates

In power electronic control, transformation, driving, signal transmission, and other fields as well as new energy, new energy vehicle power battery cooling, UPS and cooling energy storage system, large server heat dissipation, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation, etc.), in the pursuit of high performance, low noise, low temperature operation, and is limited by space, heat dissipation problems become product development ideal big restrictions, water cooling plates heat dissipation technology become the preferred thermal management style. LORI thermal energy's thermal design and thermal management engineers have rich experience in copper pipe water cooling research and development and water cooling plates process production, and can provide a full range of water cooling solutions, free of charge to provide you with the cooling plates thermal design, structural design, water cooling system assembly design and one-stop supporting services.Get more news about water cool plate factories,you can vist our website!

The copper pipe water cooling plate made using buried welding technology can effectively avoid the leakage risk of the infusion pipeline, and the liquid flow is large, the conduction heat resistance is low, and the double-sided device can be installed. we are providing you with the thermal design, structural design, pipework assembly design of water cooling plates and one-stop supplementary services.

Exposed-pipe technique: This technique applies to devices to be installed on one side. Copper pipes are pressed to deform into the grooves within an aluminum base plate and then a fly-cut is applied to the surface. This allows the quick removal of heat due to the high thermal conductivity of copper pipes. Meanwhile, the lightweight of aluminum can reduce the total weight and keep the cost to a reasonable extent.

Full-buriedpipe technique: The filler is a type of highly conductive epoxy resin which is imported from the US. When the temperature difference between two sides of a device is not critical, the liquid cold plate can be applied to either just one side or both sides of the device. Since the copper pipe thickness is not affected by any secondary machining and the application safety is ensured due to the protection of the filler, this technique is especially suitable for liquid cold plate applications which use refrigerant as the cooling medium.