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Solder mask is the core of the dual-row QFN process design.(1) The extension distance of the solder mask thickness on the surface of the via hole pad.(2) The extension distance of the solder mask thickness on the surface of the wire.(3) Solder mask thickness between pads. Case study one:A BGA POE PCB chip introduced by a company is an LGA package with heat sink pads. The center distance of the soldering end of this chip is 0.47mm; the soldering end is a round shape of ∅0.27mm, protruding from the package ground, and the sid... more