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LOW PRESSURE MOLDING TECHNOLOGY MEETS LATEST DEMANDS
Henkel’s Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding.Get more news about high and low pressure components wholesaler,you can vist our website!
Various process advantages
Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds. Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower.
The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.
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Matthew Hayward, Global Key Account for Power & Industrial Automation at Henkel highlights: “I see Technomelt as an exciting part of our Circuit-Board Protection portfolio. It offers many unique advantages that traditional potting or conformal coating is not able to provide. It is particularly well suited to high-mix low-volume applications where throughput is key. The ability to apply this material only where is needed is a huge benefit. This enables one to ‘skyline’ an application (encapsulating only the components that require protection), or to significantly reduce the weight due to substantially less material usage.”
The encapsulating material provides exceptional electrical insulation, as well as resistance to a broad range of chemicals, extreme thermal cycling across high and low temperatures, and vibrations. The internal electronics are fully protected against outside elements, including ingress of water and dust, and long-term UV exposure.
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